Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
The Semico Summit is an executive conference focused on strategic issues of major concern within our industry. Widely revered as the semiconductor event of the year, the Summit has been in existence since 1997. There are ample opportunities for interaction with top-level leaders in a casual setting. Traditionally, the event kicks off with golf & a welcome reception. A well-attended president’s dinner follows the Day 1 sessions where the industry's best and brightest gather for keynotes and lively panel discussions. Hot button issues are pressed with featured presentations delivered by internationally recognized leaders followed by informative Q&A sessions. The Summit also includes an overall semiconductor outlook delivered by Semico’s president, Jim Feldhan.
published by Adrienne Downey on Fri, 2014-11-21 23:20
Keyssa recently announced a new wireless technology: Kiss Connectivity. Kiss is a point-to-point technology (as in one centimeter apart) that enables devices to transfer or stream data at 6Gb/sec, which is faster than USB 3.0 5Gb/sec speed. Keyssa promises the transfer of entire movies in seconds. Picture NFC on some serious steroids and you’ve got it. The table below shows where Kiss sits on the speed spectrum compared to some other popular connectivity technologies.
Some big names in the electronics industries are behind this company. The Chairman of the Board of Keyssa is Nest’s CEO Tony Fadell. Keyssa is backed by Intel and Samsung, among other companies.
If Kiss takes off, it will squash TransferJet’s chances of making much of a splash in the market; it has been struggling to make headway already. Depending on how much it costs, and the security level it brings, it may make a dent in NFC’s market as well, but NFC is really suited for enabling things like smart cards, tickets, and hotel keys where small bits of data is being transferred, so the overlap there is not as great. Pricing has not been announced yet for Kiss.
Connectivity and interoperability are key elements for the IoT. The goal is to generate data from many end nodes in products and devices. These are physical objects with unique IP addresses. Consumers want products and services that will enhance and improve their lifestyles. The forecast for the number of connected devices is expected to reach 36 billion units by 2020.
published by Tony Massimini on Tue, 2014-11-11 23:36
Last week at the MEMS Executive Congress in Scottsdale, Arizona (Nov. 5-7, 2014) two separate announcements were made that will have long term impact on sensors. The MEMS Industry Group announced the first open source algorithm community for sensor fusion and the MIPI Alliance introduced a new sensor interface specification.
The I2C, also known as I Squared C, standard has been used extensively for sensor interface. Many sensor hub controllers, mostly microcontrollers, use I2C for connecting to sensors. But I2C has its limitations in terms of power, speed and scalability. SPI is another interface standard that is used for sensors, but this requires more pins.
MIPI is addressing the interface fragmentation and scalability issues with a new sensor interface specification, MIPI I3C. As that name implies it is backward compatible with I2C. But the new standard provides data throughput capabilities comparable to SPI. According to MIPI “the name MIPI SenseWire℠ will be used to describe the application of I3C℠ in mobile devices and the use of the I3C interface for mobile devices connecting to a set of sensors, directly or indirectly.”
This new standard has been developed because of the steadily growing proliferation of sensors in smartphones. A new standard was needed that could be scalable. MIPI has developed I3C with the participation of sensor vendors and other companies in the mobile ecosystem.
The 3D printing world is an exciting place to be right now. For do-it-yourselfers with an artistic or engineering bent, 3D printing delivers a whole new toolbox, enabling designs that were not possible before with exciting new materials. These DIYers will often build their own 3D printers from scratch. The RepRap movement was formed with the goal of creating a self-replicating manufacturing machine.
The first self-replicating 3D printer was built in 2008 by mechanical engineers at the University of Bath. Since then, the hobbyist 3D printer movement has blossomed from a grad school project to thriving hobbyist community. A 3D printer can be built from scratch using almost any building material (plywood, laser cut acrylic, machined aluminum, LEGO bricks, etc.), however all printers need at least one type of commercially manufactured hardware: electronics.
The MEMS Industry Group is holding its annual Executive Congress in Phoenix, AZ this week, November 5-7. Tony Massimini, Chief of Technology of Semico Research Corp. will be coaching two companies participating in the Elevator Pitch session on Thursday, Nov. 6.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2002-2018. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing Micro Logic, Communications, Other Micro Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Digital Bipolar. In addition, there is a five-page summary write-up providing the major assumptions behind the forecast and changes from the previous quarter.
As electronic systems evolved to mobile devices the importance of analog has grown. Interfacing with the real world via cameras, touch, gesture controls, audio and video applications all require analog functionality. In addition, power management ICs are critical to the success of these devices. These growing applications have added significant volumes to the analog unit sales.
Rolling out a new semiconductor technology always has its challenges, and it’s also usually accompanied by speculations and surprises. In 2011, at the 22nm process technology node, Intel surprised the semiconductor industry by introducing a three dimensional transistor structure, which Intel calls Tri-Gate, but is more commonly referred to in the industry as FinFETs. Most of the speculators were expecting FinFETs to be rolled out at the 14nm node.