Semico is a semiconductor marketing & consulting research company located in Phoenix, Arizona. We offer custom consulting, portfolio packages, individual market research studies and premier industry conferences.
The next evolutionary step for the SoC Market is ... IP Subsystems. This concept involves a "divide and conquer" design strategy that enables designers to increase integration and meet rising customer expectations of performance and functionality. Semico Research has a new report, "The IP Subsystem Market: An Evolving Landscape", which examines this market in detail. Different SoC types are aimed at different applications, and the report details the average number of discrete IP blocks per Basic, Value Multicore, and Advanced Performance Multicore SoC.
published by Adrienne Downey on Thu, 2016-07-21 00:58
Semico Research was pleased to host the 3D printing TechXPOT at SEMICON West 2016, in conjunction with SEMI. We also hosted the inaugural 3D printing session at SEMICON West 2014. What is striking is how much the 3D printing industry has changed in those two years. In 2014, 3D printing was at the height of media attention; the major questions were when each home would have its own 3D printer. In 2016, the conversation is much more focused on certain industries where 3D printing shines—namely, healthcare, automotive, and aerospace. In 2014, we were just beginning to put plastics and metals in the same 3D printed object. In 2016, the focus is now on refining those materials for conductivity and reducing design time and costs for PCBs.
As the semiconductor industry approaches the end of the second decade of the 21st century, substantial changes to the System-on-a-Chip (SoC) design methodology are taking shape. Instead of dealing with SoC design at the lowest common denominator – the discrete SIP block, SoC designers now look to move up a layer of abstraction to design with system level functionality to reduce the effort and cost associated with complex SoC designs today.
The Wafer Demand Summary and Assumptions is a quarterly publication. It includes an excel spreadsheet with annual wafer demand by product by technology from 2010-2020. Product categories include DRAM, SRAM, NAND, NOR, Other Non-volatile, MPU, MCU, DSP, Computing Micro Logic, Communications, Other Micro Logic, Programmable Logic, Standard Cell, Gate Array, Analog, Discrete, Optoelectronics, Digital Bipolar. In addition, there is a summary write-up providing the major assumptions behind the forecast and changes from the previous quarter.
Interest in China is at a fever pitch, with the country's National IC Industry Investment Fund leading the way. The latest to announce a project in China is GLOBALFOUNDRIES, with plans for a 300mm fab in a joint venture with the government of Chongqing. As the project involves upgrading an existing fab, production is planned for 2017. Lots of projects are going on in China right now -- are you keeping up?
The market for Micro Electrical Mechanical Systems (MEMS) has been growing at a fast rate. In 2015 sales of MEMS devices exceeded $14.2 billion, an annual growth of 11.6%. Semico Research projects that by 2020 MEMS sales will reach $28.7 billion. This is a Compound Annual Growth Rate (CAGR) of 15.1% from 2015 to 2020. Gyroscopes and accelerometers will account for a significant amount of the MEMS revenues. But growth will be driven by a wide variety of emerging MEMS.
Silicon wafers are the basic building block for the semiconductors used for the smallest sensor in a light bulb to the most advanced electronic system in the space shuttle. It all starts from semiconductor grade polysilicon and is processed precisely to fit the needs of each application.