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A Special Thanks To All Our Sponsors!
TSMC is the Golf Tournament Sponsor
for this event.
Founded in 1987, TSMC is the world's
largest dedicated semiconductor foundry. As the founder and leader of
this industry, TSMC has built its reputation by offering advanced wafer
production processes and unparalleled manufacturing efficiency. From its
inception, TSMC has consistently offered its customers the foundry
industry's leading technologies. The company's manufacturing capacity is
currently about 4.3 million wafers, while its revenues represent some
50% of the global foundry market.
ARC International is the Sponsor for the Sunday Evening Welcome Reception event.
ARC International is the world leader in configurable processor technology. ARC licenses patented configurable CPU/DSP processors and multimedia subsystems that enable customers to design products that give them a strategic competitive advantage in the marketplace. Using ARC's configurable cores and subsystems, licensees can develop highly differentiated ARC-Based™ system-on-chips (SoCs) that consume less power, are less expensive to produce and provide protection from cloning — distinct advantages over non-configurable, "fixed architecture" alternatives.
IBM, Chartered and Samsung Electronics (Common Platform) are the
Monday evening Cocktail Reception & President Dinner Sponsors
for this event.
IBM, Chartered and Samsung Electronics have broken new ground in the semiconductor industry with a unique collaboration focused on leading-edge, jointly developed digital CMOS process technologies and advanced manufacturing. The Common Platform model is further supported by a comprehensive ecosystem of design enablement and implementation partners from the EDA, IP and design services industries. This ecosystem allows foundry customers to source their chip designs to multiple 300mm foundries with minimal design work, unprecedented flexibility and choice. The Common Platform model features 90nm, 65nm, 45nm and 32nm technologies. For more information on the Common Platform, visit http://www.commonplatform.com.
Marcy NanoCenter and NY Loves Nanotech are the Badge sponsors
for this event.
Located in the heart of Upstate New York, Marcy NanoCenter is the premiere available greenfield site in the Northeast US. The 300-acre shovel-ready site is located adjacent to the State University of New York Institute of Technology’s (SUNYIT) and boasts an impressive array of infrastructure and utility assets. An abundance of water availability in the local supply and a top-quality power supply free of interruptions (99.9999% reliability), the site far exceeds the industry’s rigorous infrastructure requirements for sewer, water, power, gas, and telecommunications. Recognized as a “world class” site by an industry leader in 2006, Marcy NanoCenter is poised for immediate development; improvement plans in place would allow a new customer to rapidly deploy from announcement to first wafer out in less than 36 months.
With over $14 billion invested in the past 10 years, New York’s Tech Valley is a global leader in high-technology research and development, educated and skilled workforce, shovel ready sites/buildings and competitive incentives. With breathtaking scenic beauty, cultural heritage, and exciting recreational opportunities, Tech Valley is a rich and diverse region for quality living. As home to Albany Nanotech’s world-class collaborative $4.5 billion R&D center and future site of AMD’s 32nm $4 billion leading-edge manufacturing facility, the Capital Region of New York’s Tech Valley has emerged as the premier global location for nano-electronics and semiconductor related companies.
NY Loves Nanotech is a consortium of like-minded organizations consisting of economic development groups, academia and technology equipment suppliers that have joined forces to promote New York and all it has to offer.
Gerson Lehrman Group (GLG) is Monday's Breakfast sponsor
for this event.
Gerson Lehrman Group (GLG)
manages the world’s leading network of experts. Since 1998, its platform for consultation and collaboration has helped the world’s leading financial services firms, consultancies, corporations, and nonprofits find, engage, and manage experts in a broad range of industries and disciplines. GLG’s unparalleled network of the world’s leading expert consultants, known as the GLG Councils, includes more than 175,000 subject-matter experts who educate and provide insight to decision-makers worldwide. The GLG
Technology, Media & Telecommunications (TMT) CouncilsSM alone consists of over 35,000 industry experts and professionals globally who consult through a wide range of consulting methods, including telephone consultations, expert surveys and seminars.
To become a Council Member, please CLICK HERE.
Colliers International's ATREG is Tuesday's Breakfast sponsor
for this event.
ATREG is a specialized team focused on acquisitions and dispositions of advanced technology assets. Established in 1997, the group has represented over US$1.4 billion in transactions and is the only group to have sold operational semiconductor fabs for their intended use. In addition to operational facility sales including supply contracts and intellectual property, ATREG has successfully sold, in separate asset sales, the complete, integrated tool line and the fab infrastructure at premium prices.
Electronic Design is a Media Sponsor for
this event.
Electronic Design provides leading-edge technical information to electronics engineers and engineering managers around the world -- individuals responsible for the design and development of electronic original equipment manufacturers' products and systems. Electronic Design keeps its readers abreast of rapid technological advances and their applications at the chip, board and systems levels. Articles are written "engineer-to-engineer", and are balanced to provide the right mix of technology, product and applications information.
Future Fab International is a Media Sponsor for
this event.
Future Fab International, published by Mazik Media Inc., has become the semiconductor industry's first exclusively digital publisher with the 2008 launch of the 24th Edition of Future Fab International – the first magazine to reunite the fragmented Design/Fab/Packaging sectors.
In the nanometer manufacturing era, design, fab and packaging technologies are becoming increasingly interdependent; Design for Manufacturing (DFM), Design for Yield (DFY), Design for Test (DFT), Wafer-Level Packaging, Through Silicon Vias & Vertical Integration are all set to become more and more prevalent, but there is no magazine that can cope with issues across the space. Not until Future Fab International’s digital editions. Now there is one magazine that all disciplines can contribute to and all can take technical information from, with no limit on who can subscribe and a flexible digital platform that is only in the beginnings of realizing its potential.
MEPTEC is a Media Sponsor for
this event.
MEPTEC (Microelectronics Packaging and
Test Engineering Council) is a trade association of over 600
semiconductor suppliers, manufacturers and individuals committed to
enhancing the competitiveness of the back-end portion of the
semiconductor business. MEPTEC is concerned exclusively with assembly,
packaging and test issues and is dedicated to the advancement of that
segment of the industry. Since its inception over 25 years ago, MEPTEC
has provided a forum for semiconductor packaging and test professionals
to learn and exchange ideas that relate to assembly, test and handling.
Through its membership and an Advisory Board consisting of individuals
from many different segments of the back-end semiconductor industry,
MEPTEC continuously strives to improve and elevate the roles of assembly
and test professionals in the industry.
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